About the role
Responsible for the development, optimization, and sustaining of wafer back grinding processes for semiconductor devices. The engineer will lead technology development projects, work with cross-functional teams, and collaborate with suppliers to ensure high-yield, low-cost, and reliable back grinding processes for volume manufacturing.
What you will do:
Process Development:
Develop and qualify wafer back grinding, stress relief, and cleaning processes for various wafer types and thickness requirements.
Define and implement process parameters for thin wafer applications (e.g., ≤100 µm).
Evaluate and introduce new equipment, materials, and process flows to meet future technology nodes.
Technology Transfer:
Support technology transfer from R&D to high-volume manufacturing (HVM).
Collaborate with external manufacturing partners (e.g., OSATs) for process alignment and capability matching.
Process Optimization:
Lead yield improvement and cost-reduction initiatives through process tuning and design of experiments (DOE).
Develop and implement SPC and FMEA for robust process control.
Problem Solving:
Perform root cause analysis for yield loss, defects, and reliability issues related to back grinding processes.
Implement corrective and preventive actions in coordination with quality and failure analysis teams.
Cross-functional Collaboration:
Work closely with packaging design, product engineering, and quality teams to ensure package integrity.
Interface with equipment vendors for tool evaluation, upgrades, and maintenance.
Documentation & Compliance:
Create and maintain process documentation (SOPs, process specs, work instructions).
Ensure process compliance with customer requirements and industry standards (e.g., JEDEC, IATF 16949).
What you will need:
Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Microelectronics, or a related field.
Minimum 3–5 years experience in wafer-level packaging or back-end semiconductor process development.
Strong knowledge of wafer thinning, tape mounting/demounting, dicing, and post-grind cleaning.
Hands-on experience with back grinding equipment (e.g., DISCO,).
Familiar with thin wafer handling and warpage control methods.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.
