The Die Attach Process Development Senior Engineer plays a critical leadership role in the innovation, development, and industrialization of die attach processes and technologies. This position is responsible for driving robust process solutions, supporting new product introduction (NPI), and ensuring smooth transfer to high-volume manufacturing (HVM) for standard and advanced semiconductor packaging platforms.
Key Responsibilities:
Lead die attach process development for a wide range of packages including QFN, DFN, BGA, power packages, SiP, and next-gen 2.5D/3D packages.
Spearhead the qualification of advanced die attach materials (e.g., epoxy, sintered paste, solder, films) to meet electrical, thermal, and mechanical requirements.
Drive DOEs, process optimization, and material evaluation to achieve high reliability, low voiding, and consistent die placement performance.
Establish design rules, material specs, and process guidelines for die attach in collaboration with product and package design teams.
Interface with cross-functional teams (R&D, Product Engineering, Reliability, Manufacturing) to align process solutions with business goals.
Develop and implement advanced bonding techniques, such as sintering, eutectic attach, flip chip, or hybrid attach.
Provide technical leadership for root cause analysis and resolution of die attach-related yield and reliability issues.
Collaborate with equipment vendors and material suppliers to bring in state-of-the-art solutions and assess tool capabilities (e.g., ASM, Palomar, Datacon).
Author and maintain process documentation, including SOPs, FMEAs, control plans, and technology roadmaps.
Support technology transfers to internal factories or OSATs and ensure stable ramp to volume production.
Qualifications:
Bachelor’s or Master’s Degree in Materials Science, Mechanical Engineering, Electronics, Chemical Engineering, or related fields.
8+ years of hands-on experience in die attach process development or assembly engineering in the semiconductor industry.
Proven expertise in die attach materials, process design, thermal management, and packaging reliability.
In-depth experience with bonding equipment, void analysis (X-ray, SAM), die shear/pull testing, and warpage control.
Proficient in using statistical tools (JMP, Minitab), SPC, and root cause methodologies (8D, DMAIC, Fishbone).
Strong communication and documentation skills to influence cross-functional teams and executive stakeholders.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.
