Job Summary:
We are seeking a motivated and detail-oriented intern to join our Component Failure Analysis team. This internship provides a unique opportunity to gain hands-on experience in material analysis and failure investigation of electronic components, particularly focusing on ceramic substrates. The successful candidate will work closely with cross-functional teams to identify root causes of component failures and contribute to the development of corrective and preventive actions.
Responsibilities:
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Conduct reviews of cracked ceramic substrates and related component characteristics.
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Investigate failures at both hybrid manufacturing and PCBA (Printed Circuit Board Assembly) process levels.
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Perform material-level analysis and in-depth process studies to determine failure mechanisms.
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Utilize Finite Element Analysis (FEA) tools to simulate stress and validate suspected root causes.
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Propose corrective actions based on identified causes and recommend enhancements to material inspection methods.
Requirements:
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Must possess or currently pursuing at least a Bachelor’s Degree in Engineering (Materials, Mechanical, Electrical, or related disciplines).
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No prior working experience required; training and guidance will be provided.
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Willingness to work on-site in Penang Science Park.
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Strong organizational and time management skills.
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Excellent interpersonal and communication abilities.
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Detail-oriented, analytical, and results-driven.
