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Equipment Engineer (Mold/Wire Bond) - MYS, Kuala Lumpur

Texas Instruments
Kuala Lumpur
Sepenuh masa
1 hari yang lepas

Change the world. Love your job.
 

Role:  Equipment Engineer (Mold - Assembly))

Department: Assembly Engineering (TMG A/T)

As an Equipment Engineer specializing in Molding, you will play a key role in sustaining, improving, and innovating molding equipment and processes in our semiconductor assembly operations. You’ll work closely with cross-functional teams to ensure high equipment uptime, process stability, and continuous improvement to support manufacturing efficiency and product quality.

Responsibilities include:

 

Role:  Equipment Engineer (Wire Bond - Assembly)

Department: Assembly Engineering (TMG A/T)

We are looking for a motivated and hands-on Equipment Engineer specializing in wire bonding operations in our semiconductor assembly line. You will be responsible for sustaining daily equipment performance, executing improvement projects, and ensuring process stability and product quality through close collaboration with cross-functional teams.

Minimum requirements:


Preferred qualifications:

Why TI?
About Texas Instruments Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.
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