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Immediate Opening for Director Package Technology

PAN ASIA SOFTWARE SOLUTIONS SDN BHD
RM 10,580 - RM 20,000 setahun
Malacca City, Melaka
Sepenuh masa
1 minggu yang lepas

Greetings!!!

We have an Immediate Openings Director Package Technology with our reputed Client.

Work Location: Melaka

Exp: Min 10 years

Budget – RM. 20000

Job Description

· Responsible for making timely and accurate decisions regarding overall team /engineering results for Platform and Segment .

· Priorities PT activities with the right resources and make effective decisions in support of a compact project plan, using right techniques includes 8D approach , DMAIC for problem solving.

· Lead and manage PT team to support project teams to realize A/I Projects, Pre - DEV projects, InnoNET deliverables and strategic or roadmap initiatives.

· Be part of the management team and responsible to achieve defined target i.e. T2M, Quality, performance target and support the platform in realizing the Platform KPI .

· To drive Technology integration to ensure inter process related risk are mitigated and addressed.

· To define packaging solution for BLs to fit into product requirements, include package construction, layout.

· To drive Innovative solution in material development including leadframe and substrate designs to realize innovative and new packaging concept.

· Execute and promote technical leadership towards greater technical competency in the relevant FOK.

· Representing development , interfaces to Business Division and Multi development locations and internal partners on problem solving, new process development and best practice sharing & implementation.

· You are best equipped for this task if you have:

· Masters/Bachelor’s Degree in Engineering (Electrical / Electronics / Microelectronics / Mechanical / Materials.

· More than 12 years of experience in semiconductor related industry and experience in leading a team of professional engineers and team managers (minimum 5 peoples).

· Analytical and problem solving skills (8D, DMAIC).

· FMEA Approach.

· Familiar with Intellectual Property process.

· Semiconductor Process Engineering and knowledge in semiconductor packaging will be an added advantage.

· People Management with leadership skills.

Interested Share your updated resume to [email protected] or Watsapp: +60 165720562 along with below details

Current Salary:

Expected Salary:

Notice Period:

Total Exp:

Relevant Exp:

{Note: if it doesn't suit you, please refer your matching friends or kindly ignore it}

Nithya Senior IT Talent Acquisition Specialist

HP : +6016 572 0562

Job Types: Full-time, Permanent

Pay: RM10,580.00 - RM20,000.00 per year

Schedule:

Work Location: In person

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